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The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Frontiers of Mechanical Engineering 2006, Volume 1, Issue 2,   Pages 238-241 doi: 10.1007/s11465-006-0011-5

Abstract: Electrostatic-alloy bonding of silicon wafer with glass deposited by Au to form Si/Au-glass water, andbonding of Si/Au-glass with silicon wafer were researched during fabrication of pressure sensors.then Si-Au alloy bonding was formed by annealing at 400vH for 2 h.The air sealability of the cavity after bonding was finally tested using the N filling method.The results indicate that large bond strength was obtained at the bonding interface.

Keywords： Si/Au-glass     strength     MEMS packaging     process     sandwich structure    

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Ultraviolet exposure enhanced silicon direct bonding

Guanglan LIAO, Xuekun ZHANG, Xiaohui LIN, Canghai MA, Lei NIE, Tielin SHI,

Frontiers of Mechanical Engineering 2010, Volume 5, Issue 1,   Pages 87-92 doi: 10.1007/s11465-009-0078-x

Abstract: The effects of UV exposure on silicon wafers’ nano-topography and bonding strength are studied.The correlations of annealing temperature and annealing time vs. bonding strength are experimentallyResults indicate that the bonding strength increases sharply then gently with increasing annealing temperatureIt follows from the results that the bonding strength of silicon wafer pairs with UV exposure decreases, and the variation trends of bonding strength vs.

Keywords： ultraviolet (UV) exposure     silicon direct bonding     bonding strength     reliability    

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Patterned wafer bonding using ultraviolet adhesive

Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI

Frontiers of Mechanical Engineering 2011, Volume 6, Issue 2,   Pages 214-218 doi: 10.1007/s11465-011-0130-5

Abstract:

The process of patterned wafer bonding using ultraviolet (UV) adhesive as the intermediate layer wasappropriate pre-drying temperature (60°C), and predrying time (6 min), we obtained the intermediate layer bondingExperimental results indicate that patterned wafer bonding using UV adhesive is achieved under room temperaturehas advantages of easy operation, low cost, and no plugging or leakage in the patterned area after bondingPatterned wafer bonding using UV adhesive will have great potential in the fabrication of microfluidic

Keywords： ultraviolet (UV) adhesive     intermediate layer     patterned wafer bonding    

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A space solar cell bonding robot

FU Zhuang, ZHAO Yan-zheng, LIU Ren-qiang, DONG Zhi

Frontiers of Mechanical Engineering 2006, Volume 1, Issue 3,   Pages 360-363 doi: 10.1007/s11465-006-0027-x

Abstract: A space solar cell bonding robot system which consists of a three-axis Cartesian coordinate s robot,coating device, bonding device, orientation plate, and control subsystem was studied.

Keywords： Cartesian coordinate     thickness     three-axis Cartesian     orientation     control subsystem    

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Damage mode and failure mechanism of starch based API gluelam bonding

Shi Junyou,Xu Wenbiao and Wang Shumin

Strategic Study of CAE 2014, Volume 16, Issue 4,   Pages 40-44

Abstract:

The starch- based aqueous polymer isocycante（API）gluelam bonding as theresearch object，with tensile shear strength as a key evaluation index，accelerated aging tests on gluelambonding to study damage mode and failure mechanism of the bonding The results show that：the adhesiveIn the early stage of the aging tests，the effect of temperature on the tensile shear strength is moreimportant；however，with the increase of aging time，the effect of humidity on tensile shear strength becomes

Keywords： bonding structure     accelerated aging     fracture character     damage mode    

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Towards Cr(VI)-free anodization of aluminum alloys for aerospace adhesive bonding applications: A review

Shoshan T. Abrahami, John M. M. de Kok, Herman Terryn, Johannes M. C. Mol

Frontiers of Chemical Science and Engineering 2017, Volume 11, Issue 3,   Pages 465-482 doi: 10.1007/s11705-017-1641-3

Abstract: For more than six decades, chromic acid anodizing (CAA) has been the central process in the surface pre-treatment of aluminum for adhesively bonded aircraft structures. Unfortunately, this electrolyte contains hexavalent chromium (Cr(VI)), a compound known for its toxicity and carcinogenic properties. To comply with the new strict international regulations, the Cr(VI)-era will soon have to come to an end. Anodizing aluminum in acid electrolytes produces a self-ordered porous oxide layer. Although different acids can be used to create this type of structure, the excellent adhesion and corrosion resistance that is currently achieved by the complete Cr(VI)-based process is not easily matched. This paper provides a critical overview and appraisal of proposed alternatives to CAA, including combinations of multiple anodizing steps, pre- and post anodizing treatments. The work is presented in terms of the modifications to the oxide properties, such as morphological features (e.g., pore size, barrier layer thickness) and surface chemistry, in order to evaluate the link between fundamental principles of adhesion and bond performance.

Keywords： aluminum     Cr(VI)-free     surface pre-treatments     anodizing     adhesive bonding    

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ARC welding method for bonding steel with aluminum

Zhenyang LU, Pengfei HUANG, Wenning GAO, Yan LI, Hanpeng ZHANG, Shuyan YIN

Frontiers of Mechanical Engineering 2009, Volume 4, Issue 2,   Pages 134-146 doi: 10.1007/s11465-009-0033-x

Abstract: Tensile strength tests prove that the joint breaks at the heat-affected zone and the strength is higher

Keywords： joining of steel and aluminum     low energy input welding     arc welding     fusion welding – brazing    

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Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology

Wang Weiyuan,Wang Yuelin

Strategic Study of CAE 2002, Volume 4, Issue 6,   Pages 56-62

Abstract: It is based on bulk silicon bonding technology and film sealed technology.The bulk silicon bonding technology includes electrostatic bonding, silicon direct bonding and interfaciallayer assisted bonding.

Keywords： packaging of MEMS     bulk silicon bonding technology     film-sealed technology    

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Hyperbranched magnetic polymer: highly efficient removal of Cr(VI) and application in electroplating wastewater

Frontiers of Chemical Science and Engineering 2023, Volume 17, Issue 10,   Pages 1568-1580 doi: 10.1007/s11705-023-2303-2

Abstract: By using a two-step hydrothermal method and trithiocyanuric acid (TTCA), 2,4,6-trihydrazino-1,3,5-triazine (THT), and Fe3O4 as raw materials, a spherical magnetic adsorbent polymer (TTCA/THT@Fe3O4) was synthesized to achieve the efficient removal of Cr(VI) from wastewater. Under optimal adsorption conditions, the maximum adsorption capacity of TTCA/THT@Fe3O4 for Cr(VI) can reach 1340 mg∙g‒1. Notably, the removal efficiency can approach 98.9%, even at the lower concentration of 20 mg∙L‒1 Cr(VI). For actual wastewater containing Cr(VI), the Cr(VI) concentration was reduced from 25.8 to 0.4 mg∙L‒1, a remarkable 20% lower than the current industry discharge standard value. A mechanism for the high adsorption performance of Cr(VI) on TTCA/THT@Fe3O4 was investigated using Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy, and density functional theory. It can be plausibly attributed to the formation of Cr/N and Cr/S coordination bonds. Additionally, surface electrostatic adsorption, reduction effects, and the spherical polymer structure increase the contact area with Cr(VI), maximizing adsorption. The synergistic effect of adsorption and reduction enhances the adsorption performance of TTCA/THT@Fe3O4 for Cr(VI) and total chromium in water. The resultant polymer has a simple preparation process, excellent adsorption performance, easy magnetic separation, and promising application for actual wastewater.

Keywords： magnetic polymer     chromium removal     hydrogen bonding     recyclability     actual wastewater    

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Evaluating the material strength from fracture angle under uniaxial loading

Jitang FAN

Frontiers of Structural and Civil Engineering 2019, Volume 13, Issue 2,   Pages 288-293 doi: 10.1007/s11709-018-0480-8

Abstract: The most common experimental methods of measuring material strength are the uniaxial compressive andCompressive strength is higher than tensile strength for a material.In this work, a unified relation of material strength under uniaxial compression and tension is developedThis constitutive relation is quantitatively illustrated by a function for analyzing the material strengthIt is full of interest to give a scientific illustration for designing the high-strength materials and

Keywords： strength     fracture     mechanics    

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The effects of interfacial strength on fractured microcapsule

Luthfi Muhammad MAULUDIN, Chahmi OUCIF

Frontiers of Structural and Civil Engineering 2019, Volume 13, Issue 2,   Pages 353-363 doi: 10.1007/s11709-018-0469-3

Abstract: The effects of interfacial strength on fractured microcapsule are investigated numerically.attention is given to the effects of cohesive fracture on the microcapsule interface, namely fracture strengthmicrocapsule, the load carrying capacity of self-healing material under tension increases as interfacial strengthIn addition, given the fixed fracture strength of the interface of microcapsule shell, the higher the

Keywords： interfacial strength     cohesive elements     microcapsule     core-shell thickness ratio     fracture properties    

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Effect of loading rate on shear strength parameters of mechanically and biologically treated waste

Frontiers of Environmental Science & Engineering 2022, Volume 16, Issue 12, doi: 10.1007/s11783-022-1595-7

Abstract:

● Mechanical behavior of MBT waste affected by loading rate was investigated.

Keywords： Mechanically and biologically treated waste     Landfill     Triaxial test     Loading rate     Axial strain     Shear strength    

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The strength–dilatancy characteristics embraced in hypoplasticity

Zhongzhi FU, Sihong LIU, Zijian WANG

Frontiers of Structural and Civil Engineering 2013, Volume 7, Issue 2,   Pages 178-187 doi: 10.1007/s11709-013-0191-0

Abstract: The strength-dilatancy characteristics of frictional materials embraced in the hypoplastic model proposedThe flow rule, the failure state surface equation and the strength-dilatancy relationship embraced inThe performance of the two hypoplastic models in reproducing the relationship between the peak strengthNumerical investigations show that the performance in reproducing the strength-dilatancy relationship

Keywords： strength     dilatancy     hypoplasticity     frictional materials    

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Slender reinforced concrete shear walls with high-strength concrete boundary elements

Frontiers of Structural and Civil Engineering 2023, Volume 17, Issue 1,   Pages 138-151 doi: 10.1007/s11709-022-0897-y

Abstract: advancements in the field of concrete materials over the past few decades, concrete mixes of high compressive strength, commonly referred to as high-strength concrete (HSC), have been developed.The finite-element model of a conventional normal-strength concrete (NSC) prototype wall was validatedThe HSC wall exhibited improved strength and stiffness, and thereby, allowed reduction in the longitudinalreinforcement area and size of the boundary elements for the same strength of the conventional wall.

Keywords： slender walls     high-strength concrete     rectangular and barbell-shaped walls     cold joints    

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Performance of steel bridge deck pavement structure with ultra high performance concrete based on resin bonding

Frontiers of Structural and Civil Engineering 2021, Volume 15, Issue 4,   Pages 895-904 doi: 10.1007/s11709-021-0759-z

Abstract: The EP bonding layer can nearly double the drawing strength of the pavement interface from 1.3 MPa, and

Keywords： steel bridge deck pavement     ultra-high-performance concrete     epoxy resin     composite structure     bending fatigue performance    

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Title Author Date Type Operation

The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Journal Article

Ultraviolet exposure enhanced silicon direct bonding

Guanglan LIAO, Xuekun ZHANG, Xiaohui LIN, Canghai MA, Lei NIE, Tielin SHI,

Journal Article

Patterned wafer bonding using ultraviolet adhesive

Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI

Journal Article

A space solar cell bonding robot

FU Zhuang, ZHAO Yan-zheng, LIU Ren-qiang, DONG Zhi

Journal Article

Damage mode and failure mechanism of starch based API gluelam bonding

Shi Junyou,Xu Wenbiao and Wang Shumin

Journal Article

Towards Cr(VI)-free anodization of aluminum alloys for aerospace adhesive bonding applications: A review

Shoshan T. Abrahami, John M. M. de Kok, Herman Terryn, Johannes M. C. Mol

Journal Article

ARC welding method for bonding steel with aluminum

Zhenyang LU, Pengfei HUANG, Wenning GAO, Yan LI, Hanpeng ZHANG, Shuyan YIN

Journal Article

Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology

Wang Weiyuan,Wang Yuelin

Journal Article

Hyperbranched magnetic polymer: highly efficient removal of Cr(VI) and application in electroplating wastewater

Journal Article

Evaluating the material strength from fracture angle under uniaxial loading

Jitang FAN

Journal Article

The effects of interfacial strength on fractured microcapsule

Luthfi Muhammad MAULUDIN, Chahmi OUCIF

Journal Article

Effect of loading rate on shear strength parameters of mechanically and biologically treated waste

Journal Article

The strength–dilatancy characteristics embraced in hypoplasticity

Zhongzhi FU, Sihong LIU, Zijian WANG

Journal Article

Slender reinforced concrete shear walls with high-strength concrete boundary elements

Journal Article

Performance of steel bridge deck pavement structure with ultra high performance concrete based on resin bonding

Journal Article